TY  - JOUR
AU  - Wardell, D.
AU  - Jayasuriya, R.
AU  - Totton, N.
AU  - Mills, A.
AU  - Breakwell, L.
AU  - Cole, A.
DO  - doi:10.1302/1358-992X.2022.8.005
UR  - https://doi.org/10.1302/1358-992X.2022.8.005
TI  - OPTIMIZATION AND VALIDATION OF THERMAL ADHERENCE SENSORS FOR MONITORING SPINAL ORTHOSIS WEAR-TIME IN A CLINICAL TRIAL
T2  - Orthopaedic Proceedings
VL  - 104-B
IS  - SUPP_8
PY  - 2022
SP  - 5
EP  - 5
ER  -